The glass device encompasses a four phase process of one each 100g nickel bond, 260g nickel bond, 325g resin bond, and synthetic felt discs. The lapidary program is the same with an extra 600g resin disc incorporated. M.I.T. theses are guarded by copyright. They may be viewed from this resource http://felixkqbw385.fotosdefrases.com/17-reasons-why-you-should-ignore-sintered-silicon-carbide